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FDG Datasheet(PDF) 5 Page - Vishay Siliconix

Part # FDG
Description  Axial Vitreous Leaded Wirewound Resistors with CECC Approval
PDF  7 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

FDG Datasheet(HTML) 5 Page - Vishay Siliconix

  FDG Datasheet HTML 1Page - Vishay Siliconix FDG Datasheet HTML 2Page - Vishay Siliconix FDG Datasheet HTML 3Page - Vishay Siliconix FDG Datasheet HTML 4Page - Vishay Siliconix FDG Datasheet HTML 5Page - Vishay Siliconix FDG Datasheet HTML 6Page - Vishay Siliconix FDG Datasheet HTML 7Page - Vishay Siliconix  
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FDG, FDK, FDP
www.vishay.com
Vishay Draloric
Revision: 28-Mar-17
5
Document Number: 21046
For technical questions, contact: ww1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
The requirements stated in the Test Procedures And Requirements table are based on the required and permitted limits of
CECC 40201-801. However, a number of improvements against those minimum requirements have been included. The testing
temperatures LCT = -55 °C and UCT = 200 °C are established with the climatic category -55 / 200 / 56 as defined in
CECC 40201-801.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD (1)
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (
R)
STABILITY CLASS 5 OR BETTER
4.5
-
Resistance
-
± 2 %; ± 5 %
4.7
-
Voltage proof
V-block-method; URMS = Uins; 60 s
No flashover or breakdown
Type
Uins
FDG
300 V
FDK
400 V
FDP
500 V
4.8
-
Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 200 / 20) °C
+100 ppm/K to +180 ppm/K
4.13
-
Short time overload
Overload voltage =
x rated voltage
± (0.5 % R + 0.05
)
no visible damage
Type
Duration
FDG
5 s
FDK
6 s
FDP
10 s
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations
Tensile, bending and torsion
± (0.25 % R + 0.05
)
no visible damage
4.17
20 (Ta)
Solderability
Solder bath method;
SnPb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Good tinning
(
≥
95 % covered)
no visible damage
Solder bath method;
SnAg3Cu0.5; non-activated flux;
(245 ± 5) °C; (3 ± 0.3) s
4.18
20 (Tb, Method 1A)
Resistance to
soldering heat
Unmounted components;
(260 ± 3) °C; (10 ± 1) s
± (0.25 % R + 0.05
)
no visible damage
4.19
14 (Na)
Rapid change
of temperature
30 min at LCT = -55 °C
30 min at UCT = 200 °C
5 cycles
± (0.25 % R + 0.05
)
no visible damage
4.21
27 (Ea)
Shock
Acceleration: 981 m/s2
Pulse duration: 11 ms
Wave form: half sine
3 successive shocks to be applied
in each perpendicular direction
± (0.25 % R + 0.05
)
no visible damage
4.22
6 (Fc)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude
 1.5 mm or
 200 m/s2; 6 h
± (0.25 % R + 0.05
)
no visible damage
10



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