Document Number: MPXV7002

Rev 0, 09/2005

Freescale Semiconductor

Technical Data

© Freescale Semiconductor, Inc., 2005. All rights reserved.

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXV7002 series piezoresistive transducers are state-of-the-art

monolithic silicon pressure sensors designed for a wide range of applications, but

particularly those employing a microcontroller or microprocessor with A/D inputs.

This transducer combines advanced micromachining techniques, thin-film

metallization, and bipolar processing to provide an accurate, high level analog

output signal that is proportional to the applied pressure.

Features

•

2.5% Typical Error over +10

°C to +60°C with Auto Zero

•

6.25% Maximum Error over +10

°C to +60°C without Auto Zero

•

Ideally Suited for Microprocessor or Microcontroller-Based Systems

•

Thermoplastic (PPS) Surface Mount Package

•

Temperature Compensated over +10

° to +60°C

•

Patented Silicon Shear Stress Strain Gauge

•

Available in Differential and Gauge Configurations

Typical Applications

•

Hospital Beds

•HVAC

•

Respiratory Systems

•

Process Control

ORDERING INFORMATION

Device

Type

Options

Case

No.

MPX Series

Order No.

Packing

Options

Device

Marking

SMALL OUTLINE PACKAGE (MPXV7002 SERIES)

Ported

Elements

Gauge, Axial Port, SMT

482A

MPXV7002GC6U

Rails MPXV7002G

Gauge, Axial Port, SMT

482A

MPXV7002GC6T1 Tape &

Reel

MPXV7002G

Gauge, Side Port, SMT

1369

MPXV7002GP

Trays MPXV7002G

Differential, Dual Port,

SMT

1351

MPXV7002DP

Trays MPXV7002G

Differential, Dual Port,

SMT

1351

MPXV7002DPT1

Tape &

Reel

MPXV7002G

MPXV7002

SERIES

INTEGRATED

PRESSURE SENSOR

-2 to 2 kPa (-0.3 to 0.3 psi)

0.5 to 4.5 V OUTPUT

SMALL OUTLINE PACKAGE

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch in the lead.

1

N/C

5

N/C

2

6

N/C

3

Gnd

7

N/C

4

8

N/C

MPXV7002DP

CASE 1351-01

MPXV7002GP

CASE 1369-01

SMALL OUTLINE PACKAGE

MPXV7002GC6U

CASE 482A-01

Sensing

Element

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitry

GND

Pins 1 and 5 through 8 are NO CONNECTS

for surface mount package