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MIC2103 Datasheet(PDF) 26 Page - Microchip Technology |
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MIC2103 Datasheet(HTML) 26 Page - Microchip Technology |
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26 / 42 page ![]() MIC2103/4 DS20005899A-page 26 2017 Microchip Technology Inc. 5.0 APPLICATION INFORMATION 5.1 Setting the Switching Frequency The MIC2103/4 are adjustable-frequency, synchronous buck controllers that feature a unique adaptive on-time control architecture. The switching frequency can be adjusted between 200 kHz and 600 kHz by changing the resistor divider network consisting of R19 and R20. FIGURE 5-1: Switching Frequency Adjustment. The following formula gives the estimated switching frequency: EQUATION 5-1: For a more precise setting, it is recommended to use the following graph: FIGURE 5-2: Switching Frequency vs. R20. 5.2 MOSFET Selection The MIC2103/4 controllers work from input voltages of 4.5V to 75V and have an internal 5V VDD LDO. This internal VDD LDO provides power to turn on the external N-channel power MOSFETs for the high-side and low-side switches. For applications where VDD < 5V, it is necessary that the power MOSFETs used are sub-logic level and are in full conduction mode for VGS of 2.5V. For applications when VDD > 5V; logic-level MOSFETs, whose operation is specified at VGS = 4.5V must be used. There are different criteria for choosing the high-side and low-side MOSFETs. These differences are more significant at lower duty cycles. In such an application, the high-side MOSFET is then required to switch as quickly as possible in order to minimize transition losses, whereas the low-side MOSFET can switch slower, but must handle larger RMS currents. When the duty cycle approaches 50%, the current carrying capability of the high-side MOSFET starts to become critical. It is important to note that the on-resistance of a MOSFET increases with increasing temperature. A 75°C rise in junction temperature will increase the channel resistance of the MOSFET by 50% to 75% of the resistance specified at 25°C. This change in resistance must be accounted for when calculating MOSFET power dissipation and in calculating the value of current limit. Total gate charge is the charge required to turn the MOSFET on and off under specified operating conditions (VDS and VGS). The gate charge is supplied by the MIC2103/4 gate-drive circuit. At 200 kHz switching frequency, the gate charge can be a significant source of power dissipation in the VDD/PVDD SW FB VDD 2.2μF x3 AGND MIC2103/04 BST 1μF PGND VIN VIN FREQ CS R20 R19 f SW_ADJ f O R20 R19 R20 + -------------------------- = Where: fO = Switching frequency when R19 is 100 kΩ and R20 is open. Typically 550 kHz. 0 100 200 300 400 500 600 10.00 100.00 1000.00 10000.00 R20 (k ) R19 = 100k, IOUT =10A VIN = 48V VIN =75V |
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