Advanced Low Power Schottky Logic – 54ALS93



Low Power Consumption



Input Clamp Diodes Limit High Speed

Termination Effects



Full Military Temperature Range.



Direct drop-in replacement for obsolete

components in long term programs.

Rev 1.1

28/08/21

Features:

4-bit Binary Counter Logic IC in bare die form

Description

Ordering Information

Die Size (Unsawn)

1600 x 1600

63 x 63

µm

mils

Minimum Bond Pad Size

130 x 130

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

The 54ALS93 4-bit binary counter is fabricated using a 2µm

40V bipolar process. The device comprises two 4-bit ripple

type counters consisting of four master-slave flip-flops

internally connected to provide a divide-by-two section and

a divide-by-eight section. Each section has independent

clock (CK) & asynchronous master reset (R0) inputs.

Counter state change is triggered by a high-to-low transition

on the clock. Each section can be used separately or tied

together (Q to CK) to form BCD or modulo-16 counters.

Die Dimensions in µm (mils)

1600 (63)

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