DA7280 datasheet(73/76 Pages) DIALOG

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DA7280

LRA/ERM Haptic Driver with Multiple Input Triggers,

Integrated Waveform Memory and Wideband Support

Datasheet

Revision 3.0

30-Jul-2019

CFR0011-120-00

73 of 76

7.3

Moisture Sensitivity Level

The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor

lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be

exposed to an environment with a specified maximum temperature and a maximum relative humidity

before the solder reflow process. The MSL classification is defined in Table 76.

For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be

downloaded from http://www.jedec.org.

The WLCSP package is qualified for MSL 1.

The QFN package is qualified for MSL 3.

Table 76: MSL Classification

MSL Level

Floor Lifetime

Conditions

MSL 4

72 hours

30 °C / 60 % RH

MSL 3

168 hours

30 °C / 60 % RH

MSL 2A

4 weeks

30 °C / 60 % RH

MSL 2

1 year

30 °C / 60 % RH

MSL 1

Unlimited

30 °C / 85 % RH

7.4

WLCSP Handling

Manual handling of WLCSP packages should be reduced to the absolute minimum. In cases where it

is still necessary, a vacuum pick-up tool should be used. In extreme cases plastic tweezers could be

used, but metal tweezers are not acceptable, since contact may easily damage the silicon chip.

Removal of a WLCSP package will cause damage to the solder balls. Therefore, a removed sample

cannot be reused.

WLCSP packages are sensitive to visible and infrared light. Precautions should be taken to properly

shield the chip in the final product.

7.5

Soldering Information

Refer to the IPC/JEDEC standard J-STD-020 for relevant soldering information. This document can

be downloaded from http://www.jedec.org.

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