LTC4366 datasheet(6/22 Pages) AD

6 / 22 page

LTC4249

Rev. 0

For more information www.analog.com

PIN FUNCTIONS

EN1, EN2: Enable Inputs. Pulling EN high turns on the

ECB and connects IN to OUT. Pulling EN low turns off the

ECB and disconnects IN from OUT. Toggling EN resets the

ECB when in a latched off condition.

Exposed Pad: Exposed thermal pad. The exposed pad is

internally connected to ground and provides an optimal

path for heat removal. Connect the exposed pad to a PCB

ground plane for enhanced thermal performance.

GND: Device Ground.

IMON1, IMON2: Analog Current Monitor Outputs. A resis-

tor from IMON to GND converts the scaled down output

current to a voltage. The ECB turns off if the voltage on

IMON exceeds 1.20V (primary OC threshold).

In the case of severe overcurrent, the ECB quickly turns

off if the voltage on IMON exceeds 2.4V (fast secondary

OC threshold).

The IMON outputs do not source current when RDY is low.

Connect IMON to ground if unused. Use caution when

grounding IMON because the primary and secondary

OC comparators will not function. However, short-circuit

(OUT < 1.2V) and overtemperature conditions are still

detected and turn off the ECB.

IN1, IN2: ECB Inputs. Both circuit breakers operate inde-

pendently. However, IN1 is used to bias an internal low

voltage bias supply rail. Therefore, IN2 cannot be used

without IN1 ≥ 6V. A special 5V ONLY application is dis-

cussed in the Applications Information section.

A 1µF (or greater) bypass capacitor is recommended. A

low impedance layout should be used between the input

power supply and the IN1, IN2 inputs. Trace inductance

should be kept below 400nH to minimize dissipated

energy after short-circuit events.

INTVCC: Internal Operating Supply. INTVCC is used to bias

internal circuitry. INTVCC is generated by an internal regu-

lator from IN1. A 0.01µF (or greater) bypass capacitor is

recommended.

INTVCC should not be driven or loaded with external

circuitry. However, a special 5V ONLY application is dis-

cussed in the Applications Information section.

OUT1, OUT2: ECB Outputs. When enabled, OUT is con-

nected to IN through a high voltage N-channel MOSFET.

Maximum recommended steady state current is 1.2A per

channel. ECBs may be paralleled for higher current loads.

See Applications Information for more details.

A low impedance layout should be used between the load

and the OUT1, OUT2 outputs. Trace inductance should

be kept below 400nH to minimize dissipated energy after

short-circuit events. Maximum capacitance at OUT is lim-

ited to 100µF.

RDY1, RDY2: Ready Outputs. RDY pulls low when EN

is low or after an ECB fault. After a channel is enabled,

RDY outputs remain low until the current limited operat-

ing phase is complete (10ms nominal). After the current

limited operating phase, RDY outputs release and may

be used to enable subsequent functions. For example,

RF Power Amplifier gate bias may be applied after RDY

is released.

Leave RDY open or connected to ground if unused.

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