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2020-2021 Microchip Technology Inc.

DS00003646B-page 17

LAN9255

FIGURE 5-2:

128-TQFP PACKAGE (DIMENSIONS)

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

SECTION A-A

L1

L

H

3

2

1

R

R1

Microchip Technology Drawing C04-181 Rev A

c

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Foot Length

Lead Width

Molded Package Length

Molded Package Width

Overall Length

Overall Width

Foot Angle

Footprint

Standoff

Overall Height

Lead Pitch

Number of Leads

0.75

0.60

0.45

L

0.16

14.00 BSC

14.00 BSC

16.00 BSC

16.00 BSC

-

1.00 REF

b

D1

E1

0.13

D

E

L1

0°

0.23

7°

1.00

0.40 BSC

128

NOM

MILLIMETERS

A1

A2

A

e

0.05

0.95

-

Units

N

MIN

1.05

0.15

1.20

0.10

-

MAX

Lead Bend Radius

0.08

-

-

Lead Bend Radius

0.08

0.20

-

R

R1

Exposed Pad Length

D2

9.00

8.90

9.10

Exposed Pad Width

E2

Mold Draft Angle Bottom

11°

13°

12°

3

2

Lead Angle

0°

-

-

1

9.00

8.90

9.10

11°

13°

12°

Lead Thickness

-

c

0.09

0.20