MDS 670-03 G

4

Revision 010306

www.icst.com

ICS670-03

AC Electrical Characteristics

VDD = 3.3V ±10%, Ambient Temperature -40 to +85

°C, unless stated otherwise

Note 1: Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15

pF load on CLK2. See graph on page 5 for skew vs. frequency and loading.

Thermal Characteristics

Short Circuit Current

Each output

±50

mA

Internal Pull-up Resistor

OE, select pins

200

k

Ω

Input Capacitance

OE, select pins

5

pF

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Parameter

Symbol

Conditions

Min.

Typ. Max. Units

Input Clock Frequency

See table on page 2

5

210

MHz

Output Clock Frequency

210

MHz

Output Rise Time

0.8 to 2.0 V, no load

1.5

ns

Output Fall Time

2.0 to 0.8 V, no load

1.5

ns

Output Clock Duty Cycle

measured at VDD/2

40

50

60

%

Input to Output Skew

Note 1

±100

ps

Maximum Absolute Jitter

short term

±45

ps

Maximum Jitter

one sigma

15

ps

Phase Noise, relative to

carrier, 125 MHz (x5)

100 Hz offset

-110

dBc/Hz

1 kHz offset

-122

dBc/Hz

10 kHz

-124

dBc/Hz

200 kHz

-117

dBc/Hz

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θ

JA

Still air

120

°C/W

θ

JA

1 m/s air flow

115

°C/W

θ

JA

3 m/s air flow

105

°C/W

Thermal Resistance Junction to Case

θ

JC

58

°C/W