Supply Voltage (VCC) .............................................................7V

Control Input Voltage (RE, DE) .................................-0.3V to 7V

Driver Input Voltage (DI)............................................-0.3V to 7V

Driver Output Voltage (A, B, Y, Z) ........................-7.5V to 12.5V

Receiver Input Voltage (A, B)...............................-7.5V to 12.5V

8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) ..727mW

8-Pin SO (derate 5.88mW/°C above +70°C)...............471mW

14-Pin Plastic DIP (derate 10mW/°C above +70°C) ...800mW

14-Pin SO (derate 8.33mW/°C above +70°C).............667mW

Operating Temperature Ranges

MAX34_ _C_ _ ...................................................0°C to +70°C

MAX34_ _E_ _ ............................................... -40°C to +85°C

Junction Temperature......................................................+160°C

Storage Temperature Range .............................-65°C to +160°C

Lead Temperature (soldering, 10sec) .............................+300°C

14 SOIC

PACKAGE CODE

S14+1

Outline Number

21-0041

Land Pattern Number

90-0112

Thermal Resistance, Single-Layer Board:

120

37

Thermal Resistance, Four-Layer Board:

84

34

MAX3483/MAX3485/

MAX3486/MAX3488/

MAX3490/MAX3491

3.3V-Powered, 10Mbps and Slew-Rate-Limited

True RS-485/RS-422 Transceivers

www.maximintegrated.com

Maxim Integrated │ 2

Absolute Maximum Ratings

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information