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FDMC0310AS Datasheet(PDF) 3 Page - ON Semiconductor

Part # FDMC0310AS
Description  N-Channel PowerTrench짰 SyncFETTM30 V, 21 A, 4.4 m廓
PDF  8 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FDMC0310AS Datasheet(HTML) 3 Page - ON Semiconductor

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Electrical Characteristics T
J = 25 °C unless otherwise noted
Off Characteristics
On Characteristics
Dynamic Characteristics
Switching Characteristics
Drain-Source Diode Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
BVDSS
Drain to Source Breakdown Voltage
ID = 1 mA, VGS = 0 V30
V
ΔBV
DSS
ΔT
J
Breakdown Voltage Temperature
Coefficient
ID = 10 mA, referenced to 25 °C
26
mV/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 24 V, VGS = 0 V500
μA
IGSS
Gate to Source Leakage Current, Forward
VGS = 20 V, VDS = 0 V
100
nA
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 1 mA
1.2
1.6
3.0
V
ΔV
GS(th)
ΔT
J
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 10 mA, referenced to 25 °C
-5
mV/°C
rDS(on)
Static Drain to Source On Resistance
VGS = 10 V, ID = 19 A
3.8
4.4
m
Ω
VGS = 4.5 V, ID = 17.5 A4.5
5.2
VGS = 10 V, ID = 19 A,
TJ = 125 °C
4.5
5.8
gFS
Forward Transconductance
VDS = 5 V, ID = 19 A
106
S
Ciss
Input Capacitance
VDS = 15 V, VGS = 0 V,
f = 1 MHz
2380
3165
pF
Coss
Output Capacitance
885
1175
pF
Crss
Reverse Transfer Capacitance
100
150
pF
Rg
Gate Resistance
0.1
0.7
2.5
Ω
td(on)
Turn-On Delay Time
VDD = 15 V, ID = 19 A,
VGS = 10 V, RGEN = 6 Ω
11
20
ns
tr
Rise Time
510
ns
td(off)
Turn-Off Delay Time
30
48
ns
tf
Fall Time
410
ns
Qg
Total Gate Charge
VGS = 0 V to 10 V
VDD = 15 V,
ID = 19 A
37
52
nC
Qg
Total Gate Charge
VGS = 0 V to 4.5 V18
25
nC
Qgs
Gate to Source Charge
6
nC
Qgd
Gate to Drain “Miller” Charge
6
nC
VSD
Source to Drain Diode Forward Voltage
VGS = 0 V, IS = 2 A
(Note 2)
0.6
0.8
V
VGS = 0 V, IS = 19 A
(Note 2)
0.8
1.2
trr
Reverse Recovery Time
IF = 19 A, di/dt = 300 A/μs
29
47
ns
Qrr
Reverse Recovery Charge
33
53
nC
Notes:
1. RθJA is determined with the device mounted on a 1 in
2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
2. Pulse Test: Pulse Width < 300
μs, Duty cycle < 2.0%.
3. EAS of 66 mJ is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 21 A, VDD = 27 V, VGS = 10 V. 100% tested at L= 3 mH, IAS = 10.2 A.
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied.
a. 53 °C/W when mounted on a
1 in2 pad of 2 oz copper.
b. 125 °C/W when mounted on a
minimum pad of 2 oz copper.
www.onsemi.com
2



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