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FDMC0310AS Datasheet(PDF) 3 Page - ON Semiconductor |
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FDMC0310AS Datasheet(HTML) 3 Page - ON Semiconductor |
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3 / 8 page ![]() Electrical Characteristics T J = 25 °C unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics Drain-Source Diode Characteristics Symbol Parameter Test Conditions Min Typ Max Units BVDSS Drain to Source Breakdown Voltage ID = 1 mA, VGS = 0 V30 V ΔBV DSS ΔT J Breakdown Voltage Temperature Coefficient ID = 10 mA, referenced to 25 °C 26 mV/°C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V500 μA IGSS Gate to Source Leakage Current, Forward VGS = 20 V, VDS = 0 V 100 nA VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 1 mA 1.2 1.6 3.0 V ΔV GS(th) ΔT J Gate to Source Threshold Voltage Temperature Coefficient ID = 10 mA, referenced to 25 °C -5 mV/°C rDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 19 A 3.8 4.4 m Ω VGS = 4.5 V, ID = 17.5 A4.5 5.2 VGS = 10 V, ID = 19 A, TJ = 125 °C 4.5 5.8 gFS Forward Transconductance VDS = 5 V, ID = 19 A 106 S Ciss Input Capacitance VDS = 15 V, VGS = 0 V, f = 1 MHz 2380 3165 pF Coss Output Capacitance 885 1175 pF Crss Reverse Transfer Capacitance 100 150 pF Rg Gate Resistance 0.1 0.7 2.5 Ω td(on) Turn-On Delay Time VDD = 15 V, ID = 19 A, VGS = 10 V, RGEN = 6 Ω 11 20 ns tr Rise Time 510 ns td(off) Turn-Off Delay Time 30 48 ns tf Fall Time 410 ns Qg Total Gate Charge VGS = 0 V to 10 V VDD = 15 V, ID = 19 A 37 52 nC Qg Total Gate Charge VGS = 0 V to 4.5 V18 25 nC Qgs Gate to Source Charge 6 nC Qgd Gate to Drain “Miller” Charge 6 nC VSD Source to Drain Diode Forward Voltage VGS = 0 V, IS = 2 A (Note 2) 0.6 0.8 V VGS = 0 V, IS = 19 A (Note 2) 0.8 1.2 trr Reverse Recovery Time IF = 19 A, di/dt = 300 A/μs 29 47 ns Qrr Reverse Recovery Charge 33 53 nC Notes: 1. RθJA is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. EAS of 66 mJ is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 21 A, VDD = 27 V, VGS = 10 V. 100% tested at L= 3 mH, IAS = 10.2 A. 4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied. a. 53 °C/W when mounted on a 1 in2 pad of 2 oz copper. b. 125 °C/W when mounted on a minimum pad of 2 oz copper. www.onsemi.com 2 |
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