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FDMA6676PZ Datasheet(PDF) 2 Page - ON Semiconductor

Part # FDMA6676PZ
Description  MOSFET ??Single, P-Channel, POWERTRENCH
PDF  7 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FDMA6676PZ Datasheet(HTML) 2 Page - ON Semiconductor

  FDMA6676PZ Datasheet HTML 1Page - ON Semiconductor FDMA6676PZ Datasheet HTML 2Page - ON Semiconductor FDMA6676PZ Datasheet HTML 3Page - ON Semiconductor FDMA6676PZ Datasheet HTML 4Page - ON Semiconductor FDMA6676PZ Datasheet HTML 5Page - ON Semiconductor FDMA6676PZ Datasheet HTML 6Page - ON Semiconductor FDMA6676PZ Datasheet HTML 7Page - ON Semiconductor  
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FDMA6676PZ
www.onsemi.com
2
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Ratings
Unit
VDS
Drain to Source Voltage
−30
V
VGS
Gate to Source Voltage
±25
V
ID
Drain Current − Continuous,
TA = 25°C (Note 1a)
−11
A
− Pulsed
(Note 3)
−165
PD
Power Dissipation
TA = 25°C (Note 1a)
2.4
W
Power Dissipation
TA = 25°C (Note 1b)
0.9
TJ, TSTG
Operating and Storage Junction Temperature Range
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Symbol
Characteristic
Value
Unit
RqJA
Thermal Resistance, Junction to Ambient
(Note 1a)
52
°C/W
RqJA
Thermal Resistance, Junction to Ambient
(Note 1b)
145
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
OFF CHARACTERISTICS
BVDSS
Drain to Source Breakdown Voltage
ID = −250 mA, VGS = 0 V
−30
V
DBVDSS / DTJ
Breakdown Voltage Temperature
Coefficient
ID = −250 mA,
Referenced to 25°C
−19
mV/°C
IDSS
Zero Gate Voltage Drain Current
VDS = −24 V, VGS = 0 V
−1
mA
IGSS
Gate to Source Leakage Current
VGS = ±25 V, VDS = 0 V
±10
mA
ON CHARACTERISTICS
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = −250 mA
−1.2
−2
−2.6
V
DVGS(th) / DTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = −250 mA,
Referenced to 25°C
5.9
mV/°C
rDS(on)
Static Drain to Source On Resistance VGS = −10 V, ID = −11 A
11
13.5
mW
VGS = −4.5 V, ID = −8 A
19
27
VGS = −10 V, ID = −11 A, TJ = 125°C
14.5
21
gFS
Forward Transconductance
VDD = −5 V, ID = −11 A
38
S
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
VDS = −15 V, VGS = 0 V, f = 1 MHz
1440
2160
pF
Coss
Output Capacitance
477
720
pF
Crss
Reverse Transfer Capacitance
458
690
pF
Rg
Gate Resistance
12
W
SWITCHING CHARACTERISTICS
td(on)
Turn−On Delay Time
VDD = −15 V, ID = −11 A,
VGS = −10 V, RGEN = 6 W
8.8
18
ns
tr
Rise Time
19
34
ns
td(off)
Turn−Off Delay Time
87
139
ns
tf
Fall Time
72
115
ns
Qg
Total Gate Charge
VGS = 0 V to −10 V,
VDD = −15 V, ID = −11 A
33
46
nC



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