FR06S20HT

Fast Recovery Epitaxial Diode

Document No.: F21812A

14-OCT-2021 V 2.0

www.futurewafer.com.tw

FQE-001-04

2/10

2. Contents

1. Synopsis.............................................................................................................................................. 1

1-1. General Description ................................................................................................................. 1

1-2. Feature List ............................................................................................................................... 1

1-3. Applications............................................................................................................................... 1

1-4. Benefits...................................................................................................................................... 1

1-5. Mechanical Characteristics ..................................................................................................... 1

2. Contents .............................................................................................................................................. 2

3. Electrical Property............................................................................................................................. 3

3-1. Absolute Maximum Ratings .................................................................................................... 3

3-2. Electrical Characteristics ......................................................................................................... 3

3-3. Thermal Characteristics........................................................................................................... 3

3-4. Reverse Recovery Waveform and Definitions...................................................................... 4

3-5. Ratings and Characteristics Curve ........................................................................................ 5

4. Soldering Parameters....................................................................................................................... 6

5. Package Information......................................................................................................................... 7

5-1. Dimension ................................................................................................................................. 7

5-2. PCB Pad Layout Recommendation ....................................................................................... 7

6. Packing ................................................................................................................................................ 8

6-1. Taping and Reel Specification................................................................................................ 8

6-2. Embossed Carrier Tape Specification ................................................................................... 8

6-3. Surface Mount Reel Specification .......................................................................................... 9

6-4. Tape Leader and Trailer Specification................................................................................... 9

7. Ordering Information ...................................................................................................................... 10

8. Version............................................................................................................................................... 10

8-1. History...................................................................................................................................... 10

8-2. Company Profile..................................................................................................................... 10