ISO6721 datasheet(6/49 Pages) TI

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6.4 Thermal Information

THERMAL METRIC

(1)

ISO672xB

ISO6721RB

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

104.6

98.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

48.9

33.8

°C/W

RθJB

Junction-to-board thermal resistance

52.9

°C/W

ψJT

Junction-to-top characterization parameter

7.9

2.3

°C/W

ψJB

Junction-to-board characterization parameter

52.1

46.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6720B

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

ISO6721B

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

ISO6721RB

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

ISO6720, ISO6721, ISO6721R

SLLSFJ0D – JANUARY 2020 – REVISED SEPTEMBER 2021

www.ti.com

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