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ST33G1M2M Datasheet(PDF) 1 Page - STMicroelectronics

Part # ST33G1M2M
Description  M2M industrial secure MCU with 32-bit ARM® SecurCore® SC300??CPU and high-density Flash memory
PDF  6 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33G1M2M Datasheet(HTML) 1 Page - STMicroelectronics

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March 2016
DocID028876 Rev 2
1/6
ST33GxxxM
M2M industrial secure MCU with 32-bit ARM® SecurCore®
SC300™ CPU and high-density Flash memory
Data brief
Features
Hardware features
 ARM® SecurCore® SC300™ 32-bit RISC core
cadenced at 25 MHz
 Operating temperature: –40 to 105 °C
 30 Kbytes of user RAM
 Up to 1280 Kbytes of user Flash memory with
OTP area
 Asynchronous receiver transmitter supporting
ISO/IEC 7816-3 T=0 and T=1 protocols (Slave
mode supported)
 Single wire protocol (SWP) interface for
communications with NFC router (ETSI
102-613 compliant)
 Industrial qualification (JEDEC)
 Serial peripheral interface (SPI) master/slave
interface
 Three 16-bit timers with interrupt capability
including one 16-bit timer with watchdog
capability
 Seven general-purpose I/Os enabling
proprietary protocol implementation
 1.8 V, 3 V and 5 V supply voltage ranges
 External clock frequency from 1 up to 10 MHz
 Current consumption compatible with GSM
and ETSI specifications
 Power-saving standby state
 Contact assignment compatible with
ISO/IEC 7816-2
 ESD protection greater than 4 kV (HBM)
Security features
 Active shield
 Memory protection unit (MPU)
 Monitoring of environmental parameters
 Protection against faults
 16- and 32-bit CRC calculation block (ISO
13239, IEEE 802.3, etc.)
 True random number generator
 Unique serial number on each die
 Hardware security-enhanced DES accelerator
 Hardware security-enhanced AES accelerator
 NESCRYPT coprocessor for public key
cryptography algorithm
Applications
 Industrial and machine-to-machine
 Vending machines
 Remote control/monitoring
 Access control, alarms and security
 Consumer electronics
 Mobile health (mHealth)
DFN8 6 × 5 mm
wettable flanks
Wafer
Table 1. Device summary
Part number
Memory size in Kbytes
ST33G1M2M
1280
ST33G1M0M
1024
ST33G896M
896
ST33G768M
768
ST33G640M
640
ST33G512M
512
ST33G384M
384
www.st.com


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