High Speed CMOS Logic – 54HC241

Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form

Rev 1.0

30/11/21

Description

Die Size (Unsawn)

1950 x 2050

77 x 81

µm

mils

Minimum Bond Pad Size

106 x 106

4.17 x 4.17

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si



Output Drive Capability: 15 LSTTL Loads



Low Input Current: 1µA



Outputs directly interface CMOS, NMOS and TTL



Operating Voltage Range: 2V to 6V



CMOS High Noise Immunity



Function compatible with 54LS241



Lower power alternative to Bipolar or BiCMOS logic



Full military temperature range.

Features:

The 54HC241 is produced on a 2.5µm 5V CMOS process

combining high speed LSTTL performance with CMOS low

power. The device can be used as two 4-bit buffers or one

8-bit buffer & features non-inverting inputs with two output

enables, each controlling four of the 3-state outputs. The

device improves performance & density in clock drivers, 3-

state memory address drivers & bus orientated transmitters

and receivers. Device inputs are compatible with standard

CMOS outputs; with pull-up resistors, they are compatible

with LSTTL outputs. All inputs are equipped with protection

circuits against static discharge & transient excess voltage.

Ordering Information

The following part suffixes apply:

Die Dimensions in µm (mils)

1950 (77)



No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

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