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ISO6763FDWR Datasheet(PDF) 1 Page - Texas Instruments |
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ISO6763FDWR Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 44 page ![]() ISO6760L Six-Channel Reinforced Digital Isolators with Integrated Interlock and Robust EMC 1 Features • ISO6760 with integrated Interlock function – Designed to support opposite polarity of adjacent channels – Three sets of paired interlock channels • Robust isolation barrier: – High lifetime at 1500 VRMS working voltage – Up to 5000 VRMS isolation rating – Up to 10 kV surge capability – ±130 kV/μs typical CMTI • Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V • Channel output non-inverting (ISO6760L) and inverting (ISO6760LN) options • 50 Mbps data rate • 1.71 V to 5.5 V level translation • Wide temperature range: –40°C to 125°C • 1.4 mA per channel typical at 1 Mbps • Robust electromagnetic compatibility (EMC) – System-level ESD, EFT, and surge immunity – Low emissions • Wide-SOIC (DW-16) Package • Safety-Related Certifications (pending): – DIN VDE V 0884-11:2017-01 – UL 1577 component recognition program – IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1-2011 certifications 2 Applications • Motor drives • Appliances • Grid • Building Automation 3 Description The ISO6760L and ISO6760LN devices are high- performance, six-channel digital isolators with integrated interlock function for applications requiring up to 5000 VRMS isolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC. The ISO6760L family of devices integrate a series of logic gates to provide hardware interlock functionality for adjacent channels. The interlock feature ensures that each channel, in a channel pairing, will not be enabled at the same time. If both channels in the pairing share the same input logic, the output logic will always be low. The ISO6760L family of devices have all six channels in the same direction and provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI's double capacitive silicon dioxide (SiO2) insulation barrier. Used in conjunction with intelligent power modules (IPMs), the interlock feature in these devices help prevent shoot through current between the high side and low side gate driver during turn on and turn off events. Six channels, including three pairings of interlock circuitry, are integrated in a 16-pin SOIC wide-body (DW) package with space savings greater than 50% compared to optocoupler solutions. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6760L devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. Device Description Part Number Package Body Size ISO6760L, ISO6760LN SOIC (DW) 10.30 mm × 7.50 mm C2000 MCU GND1 GND2 9 8 INC_L OUTC_L 10 7 INC_H OUTC_H 11 6 INB_L OUTB_L 12 5 INB_H OUTB_H 13 4 INA_L OUTA_L 14 3 INA_H OUTA_H 15 2 VCC1 VCC2 16 1 I N T E R L O C K I N T E R L O C K I N T E R L O C K IPM Level shift High side gate driver High side gate driver High side gate driver 3 phase IGBT inverter Low side gate driver M ISO6760L Simplified Schematic ISO6760L SLLSFO3 – DECEMBER 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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