6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

Input clamp current(2)

±20

mA

Output clamp current(2)

±20

mA

Continuous output current

±35

mA

±70

mA

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±4000

V

Charged device model (CDM), per AEC

Q100-011

CDM ESD Classification Level C4B

±1500

(1)

AEC Q100-002 indicate that HBM stressing shall be in accordrance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

6

V

Input voltage

0

V

Output voltage

0

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS573-Q1

UNIT

WRKS (VQFN)

20 PINS

Junction-to-ambient thermal resistance

83.2

°C/W

Junction-to-case (top) thermal resistance

82.6

°C/W

Junction-to-board thermal resistance

57.4

°C/W

Junction-to-top characterization parameter

14.5

°C/W

Junction-to-board characterization parameter

56.4

°C/W

Junction-to-case (bottom) thermal resistance

40.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS573-Q1

SCLS852 – DECEMBER 2021

www.ti.com

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