2SC3838

20V Matched Pair

NPN Small Signal Transistors

Document No.: F51849S

27-NOV-2021 V 2.0

www.futurewafer.com.tw

FQE-001-04

2/9

2. Contents

1. Synopsis.............................................................................................................................................. 1

1-1. Feature List ............................................................................................................................... 1

1-2. Applications............................................................................................................................... 1

1-3. Mechanical Characteristics ..................................................................................................... 1

1-4. Device Characteristics............................................................................................................. 1

2. Contents .............................................................................................................................................. 2

3. Electrical Property............................................................................................................................. 3

3-1. Electrical Characteristics ......................................................................................................... 3

3-2. On Characteristics.................................................................................................................... 3

3-3. Small Signal Characteristics ................................................................................................... 3

3-4. Classification of h FE ................................................................................................................. 3

3-5. Ratings and Characteristics Curve ........................................................................................ 4

4. Soldering Parameters....................................................................................................................... 5

5. Package Information......................................................................................................................... 6

5-1. Dimension ................................................................................................................................. 6

5-2. PCB Pad Layout Recommendation ....................................................................................... 6

6. Packing ................................................................................................................................................ 7

6-1. Taping and Reel Specification................................................................................................ 7

6-2. Embossed Carrier Tape Specification ................................................................................... 7

6-3. Surface Mount Reel Specification .......................................................................................... 8

6-4. Tape Leader and Trailer Specification................................................................................... 8

7. Ordering Information ........................................................................................................................ 9

8. Version................................................................................................................................................. 9

8-1. History........................................................................................................................................ 9

8-2. Company Profile....................................................................................................................... 9