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IRF830APBF Datasheet(PDF) 2 Page - Vishay Siliconix |
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IRF830APBF Datasheet(HTML) 2 Page - Vishay Siliconix |
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2 / 9 page ![]() IRF830A www.vishay.com Vishay Siliconix S21-0852-Rev. D, 16-Aug-2021 2 Document Number: 91061 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. Pulse width ≤ 300 μs; duty cycle ≤ 2 % c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT Maximum junction-to-ambient RthJA -62 °C/W Case-to-sink, flat, greased surface RthCS 0.50 - Maximum junction-to-case (drain) RthJC -1.7 SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-source breakdown voltage VDS VGS = 0 V, ID = 250 μA 500 - - V VDS temperature coefficient ΔVDS/TJ Reference to 25 °C, ID = 1 mA - 0.60 - V/°C Gate-source threshold voltage VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.5 V Gate-source leakage IGSS VGS = ± 30 V - - ± 100 nA Zero gate voltage drain current IDSS VDS = 500 V, VGS = 0 V - - 25 μA VDS = 400 V, VGS = 0 V, TJ = 125 °C - - 250 Drain-source on-state resistance RDS(on) VGS = 10 V ID = 3.0 A b -- 1.4 Ω Forward transconductance gfs VDS = 50 V, ID = 3.0 A b 2.8 - - S Dynamic Input capacitance Ciss VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 -620 - pF Output capacitance Coss -93 - Reverse Transfer capacitance Crss -4.3 - Output capacitance Coss VGS = 0 V; VDS = 1.0 V, f = 1.0 MHz 886 Output capacitance Coss VGS = 0 V; VDS = 400 V, f = 1.0 MHz 27 Effective output capacitance Coss eff. VGS = 0 V; VDS = 0 V to 400 V c 39 Total gate charge Qg VGS = 10 V ID = 5.0 A, VDS = 400 V, see fig. 6 and 13 b -- 24 nC Gate-source charge Qgs -- 6.3 Gate-drain charge Qgd -- 11 Turn-on delay time td(on) VDD = 250 V, ID = 5.0 A, Rg = 14 Ω, RD = 49 Ω, see fig. 10 b -10 - ns Rise time tr -21 - Turn-off delay time td(off) -21 - Fall time tf -15 - Gate input resistance Rg f = 1 MHz, open drain 1.7 - 10.7 Ω Drain-Source Body Diode Characteristics Continuous source-drain diode current IS MOSFET symbol showing the integral reverse p - n junction diode -- 5.0 A Pulsed diode forward current a ISM -- 20 Body diode voltage VSD TJ = 25 °C, IS = 5.0 A, VGS = 0 V b -- 1.5 V Body diode reverse recovery time trr TJ = 25 °C, IF = 5.0 A, dI/dt = 100 A/μs b - 430 650 ns Body diode reverse recovery charge Qrr - 1.62 2.4 μC Forward turn-on time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) S D G |
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