3

WCMB2016R4X

Test Conditions

WCMB2016R4X

Param-

eter

Description

Min.

Typ.[4]

Max.

Unit

Output HIGH Voltage

1.4

V

Output LOW Voltage

0.2

V

Input HIGH Voltage

1.4

V

Input LOW Voltage

−0.2

0.4

V

−1+1

µA

Output Leakage Cur-

rent

−1+1

µA

Current

CMOS levels

1.5

6

mA

f = 1 MHz

0.5

2

mA

Automatic CE

Power-Down Current—

CMOS Inputs

f=0 (OE, WE, BHE and BLE)

18

µA

Automatic CE

Power-Down Cur-

rent— CMOS Inputs

f = 0, Vcc=1.95V

Capacitance[5]

Parameter

Description

Test Conditions

Max.

Unit

Input Capacitance

6

pF

Output Capacitance

8

pF

Thermal Resistance

Description

Test Conditions

Symbol

BGA

Units

Thermal Resistance (Junction

to Ambient)[5]

Still Air, soldered on a 4.25 x 1.125 inch, 4-layer printed

circuit board

Θ

JA

55

°C/W

Thermal Resistance (Junction

to Case)[5]

Θ

JC

16

°C/W

Note:

5.

Tested initially and after any design or process changes that may affect these parameters.