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MIC4420 Datasheet(PDF) 11 Page - Microchip Technology |
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MIC4420 Datasheet(HTML) 11 Page - Microchip Technology |
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11 / 26 page ![]() 2018 - 2022 Microchip Technology Inc. and its subsidiaries. DS20006092B-page 11 MIC4420/9 4.0 APPLICATION INFORMATION 4.1 Supply Bypassing Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 2500 pF load to 18V in 25 ns requires a 1.8A current from the device power supply. The MIC4420/4429 has double bonding on the supply pins, the ground pins and output pins This reduces parasitic lead inductance. Low inductance enables large currents to be switched rapidly. It also reduces internal ringing that can cause voltage breakdown when the driver is operated at or near the maximum rated voltage. Internal ringing can also cause output oscillation due to feedback. This feedback is added to the input signal because it is referenced to the same ground. To guarantee low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low inductance ceramic disk capacitors with short lead lengths (less than 0.5 inch) should be used. A 1 μF low ESR film capacitor in parallel with two 0.1 μF low ESR ceramic capacitors, (such as AVX RAM GUARD®), provides adequate bypassing. Connect one ceramic capacitor directly between pins 1 and 4. Connect the second ceramic capacitor directly between pins 8 and 5. 4.2 Grounding The high current capability of the MIC4420/4429 demands careful PC board layout for best performance Because the MIC4429 is an inverting driver, any ground lead impedance will appear as negative feedback which can degrade switching speed. Feedback is especially noticeable with slow-rise time inputs. The MIC4429 input structure includes 300 mV of hysteresis to ensure clean transitions and freedom from oscillation, but attention to layout is still recommended. Figure 4-1 shows the feedback effect in detail. As the MIC4429 input begins to go positive, the output goes negative and several amperes of current flow in the ground lead. As little as 0.05Ω of PC trace resistance can produce hundreds of millivolts at the MIC4429 ground pins. If the driving logic is referenced to power ground, the effective logic input level is reduced and oscillation may result. To ensure optimum performance, separate ground traces should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4429 GND pins will ensure full logic drive to the input and ensure fast output switching. Both of the MIC4429 GND pins should, however, still be connected to power ground. FIGURE 4-1: Self-Contained Voltage Doubler. 4.3 Input Stage The input voltage level of the 4429 changes the quiescent supply current. The N channel MOSFET input stage transistor drives a 450 μA current source load. With a logic “1” input, the maximum quiescent supply current is 450 μA. Logic “0” input level signals reduce quiescent current to 55 μA maximum. The MIC4420/4429 input is designed to provide 300 mV of hysteresis. This provides clean transitions, reduces noise sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over the 4.5V to 18V operating supply voltage range. Input current is less than 10 μA over this range. The MIC4429 can be directly driven by the TL494, SG1526/1527, SG1524, TSC170, MIC38HC42, and similar switch mode power supply integrated circuits. By offloading the power-driving duties to the MIC4429 1μF 50V MKS2 UNITED CHEMCON SXE 0.1μF WIMA MKS2 1 8 6, 7 5 4 0.1μF 50V 5.6 k 560 +15 220 μF 50V BYV 10 (x 2) 35 μF 50V (x2) 1N4448 2 + + + 30 29 28 27 26 25 0 20 40 60 80 100 120 140 mA 30 LINE Output Voltage vs. Load Current |
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