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ECMF04-4HSM10 Datasheet(PDF) 9 Page - STMicroelectronics |
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ECMF04-4HSM10 Datasheet(HTML) 9 Page - STMicroelectronics |
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9 / 14 page ![]() 4 PCB assembly recommendation Figure 19. Recommended PCB layout 350 µm 350 µm 150 µm 330 µm 5000 µm Connector Host Pad layout Differential lanes (Z0 = 100 ) Differential lanes (Z0 = 100 ) Figure 20. PCB stack dimensions 40 µm 105 µm r = 4.28 ε 4.1 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Use solder paste with fine particles: powder particle size is 20-38 μm. ECMF04-4HSM10 PCB assembly recommendations DS9770 - Rev 4 page 9/14 |
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