MAX49140AXKSLASHV+T datasheet(4/13 Pages) MAXIM

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Absolute Maximum Ratings

VDD to GND.............................................................. -0.3V to +6V

IN+, IN- to GND ............................................ -0.3V to VDD + 0.3V

OUT to GND ................................................. -0.3V to VDD + 0.3V

Current into Input Pins....................................................... ±20mA

Input/Output Short-Circuit Duration to VDD or GND... Continuous

Continuous Power Dissipation (TA = +70°C), 5 Pin SC70 (derate

3.1mW/°C above +70°C), Multilayer Board ................... 246.9mW

Operating Temperature Range ...........................-40°C to +125°C

Junction Temperature (TJMAX).........................................+150°C

Storage Temperature Range ..............................-65°C to +150°C

Lead Temperature (soldering, 10s)...................................+300°C

Soldering Temperature (reflow) ........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

5 SC70

Package Code

X5+1C

Outline Number

21-0076

Land Pattern Number

90-0188

Thermal Resistance, Single-Layer Board:

Junction-to-Ambient (θJA)

324°C/W

Junction-to-Case Thermal Resistance (θJC)

115°C/W

Thermal Resistance, Four-Layer Board:

Junction-to-Ambient (θJA)

324°C/W

Junction-to-Case Thermal Resistance (θJC)

115°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

Electrical Characteristics

(VDD = 5V, VCM = 0.1V, CL = 15pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

VDD Supply Voltage

VDD

Guaranteed by PSRR specification

2.7

5.5

VDD Supply Current

IDD

VCM = 5V, VDD =

TA = -40°C to

+85°C

100

180

μA

TA = -40°C to

+125°C

200

Common-Mode Input

Voltage

VCM

Note 2

VDD

Input Offset Voltage

VOS

Note 3

0.5

Input Hysteresis

VHYS

Note 4

1.2

MAX49140

30ns, Low-Power, 3V/5V, Rail-to-Rail Single-

Supply Comparator

www.maximintegrated.com

19-100740

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