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STM8L151C2 Datasheet(PDF) 96 Page - STMicroelectronics

Part # STM8L151C2
Description  8-bit ultra-low-power MCU, up to 8 KB Flash, up to 256 bytes data EEPROM, RTC, timers, USART, I2C, SPI, ADC, comparators
PDF  123 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8L151C2 Datasheet(HTML) 96 Page - STMicroelectronics

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Electrical parameters
STM8L151x2, STM8L151x3
96/123
DS7204 Rev 11
tS
Sampling time
VAIN on PF0 fast
channel
VDDA < 2.4 V
0.43(4)(5)
--
µs
VAIN on PF0 fast
channel
2.4 V
≤VDDA≤ 3.6 V
0.22(4)(5)
--
µs
VAIN on slow channels
VDDA < 2.4 V
0.86(4)(5)
--
µs
VAIN on slow channels
2.4 V
≤VDDA≤ 3.6 V
0.41(4)(5)
--
µs
tconv
12-bit conversion time
-
12 + tS
1/fADC1
16 MHz
1(4)
µs
tWKUP
Wakeup time from OFF
state
--
-
3
µs
tIDLE
(6)
Time before a new
conversion
TA = +25 °C
-
-
1(7)
s
TA = +70 °C
-
-
20(7)
ms
TA = +125 °C
-
-
2(7)
ms
tVREFINT
Internal reference
voltage startup time
--
-
refer to
Table 44
ms
1.
The current consumption through VREF is composed of two parameters:
- one constant (max 300 µA)
- one variable (max 400 µA), only during sampling time + 2 first conversion pulses.
So, peak consumption is 300+400 = 700 µA and average consumption is 300 + [(4 sampling + 2) /16] x 400 = 450 µA at
1Msps
2.
VREF- or VDDA must be tied to ground.
3.
Guaranteed by design.
4.
Minimum sampling and conversion time is reached for maximum Rext = 0.5 k
Ω.
5.
Value obtained for continuous conversion on fast channel.
6.
The time between 2 conversions, or between ADC1 ON and the first conversion must be lower than tIDLE.
7.
The tIDLE maximum value is on the “Z” revision code of the device.
Table 48. ADC1 characteristics (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit



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