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STM8L151X6 Datasheet(PDF) 140 Page - STMicroelectronics |
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STM8L151X6 Datasheet(HTML) 140 Page - STMicroelectronics |
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140 / 147 page ![]() Package information STM8L151x6/8 STM8L152x6/8 140/147 DS6948 Rev 11 Figure 61. WLCSP32 - 32-ball, 1.913 x 3.329 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 67. WLCSP32 - 32-ball, 1.913 x 3.329 mm, 0.4 mm pitch wafer level chip scale package mechanical data(1) 1. Preliminary data. Symbol millimeters inches(2) 2. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(3) 3. Back side coating. - 0.025 - - 0.0010 - b(4) 4. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 1.878 1.913 1.948 0.0739 0.0753 0.0767 E 3.294 3.329 3.364 0.1297 0.1311 0.1324 e - 0.400 - - 0.0157 - e1 - 1.200 - - 0.0472 - e2 - 2.800 - - 0.1102 - F - 0.3565 - - 0.0140 - G - 0.2645 - - 0.0104 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 WLCSP32_FP_V1 Dpad Dsm |
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