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STM32L031C6 Datasheet(PDF) 113 Page - STMicroelectronics |
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STM32L031C6 Datasheet(HTML) 113 Page - STMicroelectronics |
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113 / 126 page  DS10668 Rev 6 113/126 STM32L031x4/6 Package information 120 Figure 50. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale recommended footprint aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 74. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale mechanical data (continued) Symbol Milimeters Inches(1) Min Typ Max Min Typ Max Table 75. WLCSP25 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed |
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