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MIC5205 Datasheet(PDF) 5 Page - Microchip Technology |
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MIC5205 Datasheet(HTML) 5 Page - Microchip Technology |
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5 / 20 page ![]() 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005785C-page 5 MIC5205 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Operating Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5s Package Thermal Resistances Thermal Resistance SOT-23-5 JA — 220 — °C/W Note 2 JC — 130 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg- ulator will go into thermal shutdown. The JA of the MIC5205-xxYM5 (all versions) is 220°C/W mounted on a PC board. |
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