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MIC5237 Datasheet(PDF) 9 Page - Microchip Technology |
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MIC5237 Datasheet(HTML) 9 Page - Microchip Technology |
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9 / 18 page ![]() 2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 9 MIC5237 EQUATION 4-4: θCS is approximately 1°C/W and θJC for the TO-220 is 3°C/W in this example. EQUATION 4-5: EQUATION 4-6: Therefore, a heat sink with a thermal resistance of 19.5°C/W will allow the part to operate safely and it will not exceed the maximum junction temperature of the device. The heat sink can be reduced by limiting power dissipation, by reducing the input voltage or output current. Either the TO-220 or TO-263 package can operate reliably at 2W of power dissipation without a heat sink. Above 2W, a heat sink is recommended. SA JA JC – = JA 125C 25C – 4.260W ----------------------------------- 23.5C/W = = SA 23.5C/W 3C/W 1C/W + – 19.5C/W = = |
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