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SISA04DN Datasheet(PDF) 1 Page - Vishay Siliconix

Part # SISA04DN
Description  N-Channel 30 V (D-S) MOSFET
PDF  13 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SISA04DN Datasheet(HTML) 1 Page - Vishay Siliconix

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SiSA04DN
www.vishay.com
Vishay Siliconix
S12-0309-Rev. A, 13-Feb-12
1
Document Number: 63709
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET ® Gen IV power MOSFET
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Switch mode power supplies
• Personal computers and servers
• Telecom bricks
•VRM’s and POL
Notes
a. Surface mounted on 1" x 1" FR4 board
b. t = 10 s
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
e. Maximum under steady state conditions is 81 °C/W
f. Based on TC = 25 °C
g. Package limited
PRODUCT SUMMARY
VDS (V)
30
RDS(on) max. () at VGS = 10 V
0.00215
RDS(on) max. () at VGS = 4.5 V
0.00310
Qg typ. (nC)
22.5
ID (A) f, g
40
Configuration
Single
PowerPAK® 1212-8 Single
Top View
1
3.3
mm
3.3
mm
Bottom View
1
S
1
S
2
S
3
S
4
G
D
8
D
7
D
6
D
5
N-Channel MOSFET
G
D
S
ORDERING INFORMATION
Package
PowerPAK 1212-8
Lead (Pb)-free and halogen-free
SiSA04DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
VDS
30
V
Gate-source voltage
VGS
+20, -16
Continuous drain current (TJ = 150 °C)
TC = 25 °C
ID
40 g
A
TC = 70 °C
40 g
TA = 25 °C
30.9 a, b
TA = 70 °C
28.3 a, b
Pulsed drain current (t = 300 μs)
IDM
80
Continuous source-drain diode current
TC = 25 °C
IS
40 g
TA = 25 °C
3.3 a, b
Single pulse avalanche current
L = 0.1 mH
IAS
20
Single pulse avalanche energy
EAS
20
mJ
Maximum power dissipation
TC = 25 °C
PD
52
W
TC = 70 °C
43
TA = 25 °C
3.7 a, b
TA = 70 °C
3.1 a, b
Operating junction and storage temperature range
TJ, Tstg
-55 to +150
°C
Soldering recommendations (peak temperature) c, d
260
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient a, e
t
 10 s
RthJA
24
33
°C/W
Maximum junction-to-case (drain)
Steady state
RthJC
1.9
2.4


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