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LTC4367 Datasheet(PDF) 23 Page - Analog Devices |
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LTC4367 Datasheet(HTML) 23 Page - Analog Devices |
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23 / 30 page ![]() LTC7000A 23 Rev. 0 For more information www.analog.com APPLICATIONS INFORMATION PC Board Layout Considerations 1. Solder the exposed pad on the backside of the LTC7000A/LTC7000A-1 packages directly to the ground plane of the board. 2. Kelvin connect the SNS+ pin to the current sense resistor. 3. Limit the resistance of the TS trace, by making it short and wide. 4. CB needs to be close to chip. 5. Always include an option in the PC board layout to place a resistor in series with the gate of any exter- nal MOSFET. High frequency oscillations are design dependent and having the option to add a series damp- ening resistor can save a design iteration of the PC board. Pin Creepage and Clearance In some higher voltage applications, the MSE16 package may not provide sufficient PC board trace clearance between high and low voltage pins. In applications where clearance is required, the LTC7000A-1 in the MSE16(12) package can be used. The MSE16(12) package has removed pins between all the adjacent high voltage and low voltage pins, providing 0.657mm clearance, which will be sufficient for most applications. For more information, refer to the printed circuit board design standards described in IPC-2221. |
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