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SSM3K341R Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # SSM3K341R
Description  MOSFETs Silicon N-channel MOS (U-MOSVII-H)
PDF  9 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM3K341R Datasheet(HTML) 3 Page - Toshiba Semiconductor

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SSM3K341R
3
6. Electrical Characteristics
6.1. Static Characteristics (Unless otherwise specified, Ta = 25 �)
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
(Note 1)
(Note 2)
(Note 3)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
Test Condition
VGS = ±16 V
VDS = 60 V
ID = 10 mA, VGS = 0 V
ID = 10 mA, VGS = -20 V
VDS = 10 V, ID = 0.1 mA
ID = 2 A, VGS = 4 V
ID = 3 A, VGS = 4.5 V
ID = 5 A, VGS = 10 V
Min
�
�
60
40
1.5
�
�
�
Typ.
�
�
�
�
�
43
36
28
Max
±10
1
�
�
2.5
69
51
36
Unit
µA
V
mΩ
Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (0.1 mA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
6.2. Dynamic Characteristics (Unless otherwise specified, Ta = 25 �)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (rise time)
Switching time (turn-on time)
Switching time (fall time)
Switching time (turn-off time)
Symbol
Ciss
Crss
Coss
tr
ton
tf
toff
Test Condition
VDS = 10 V, VGS = 0 V,
f = 1 MHz
VDD = 30 V, ID = 3 A,
VGS = 0 to 4.5 V, RG = 50 Ω
Duty ≤ 1 %,Input: tr, tf < 5 ns,
Common source,
See Chapter 6.3.
Min
�
�
�
�
�
�
�
Typ.
550
35
300
48
63
6
18
Max
�
�
�
�
�
�
�
Unit
pF
ns
6.3. Switching Time Test Circuit
Fig. 6.3.1
Switching Time Test Circuit
Fig. 6.3.2
Input Waveform/Output Waveform
6.4. Gate Charge Characteristics (Unless otherwise specified, Ta = 25 �)
Characteristics
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Qg
Qgs1
Qgd
Test Condition
VDD = 48 V, ID = 2 A,
VGS = 10 V
Min
�
�
�
Typ.
9.3
1.8
2.0
Max
�
�
�
Unit
nC
2021-02-03
Rev.8.0
©2016-2021
Toshiba Electronic Devices & Storage Corporation



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