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MSK0041 Datasheet(PDF) 3 Page - M.S. Kennedy Corporation |
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MSK0041 Datasheet(HTML) 3 Page - M.S. Kennedy Corporation |
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3 / 7 page ![]() HEAT SINKING To select the correct heat sink for your application, refer to the thermal model and governing equation below. Thermal Model: APPLICATION NOTES CURRENT LIMIT The MSK 0041 has an on-board current limit scheme de- signed to limit the output drivers anytime output current exceeds a predetermined limit. The following formula may be used to determine the value of the current limit resistance necessary to establish the desired current limit. Current Limit Connection 3 Rev. - 4/02 RSC= 0.7 ISC ___ See "Application Circuits" in this data sheet for additional information on current limit connections. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency by- pass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0.1 microfarad ceramic capacitor in parallel with a 4.7 microfarad tantalum capacitor from each power supply pin to ground.This ca- pacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible. SAFE OPERATING AREA The safe operating area curve is a graphical representation of the power handling capability of the amplifier under vari- ous conditions. The wire bond current carrying capability, transistor junction temperature and secondary breakdown limitations are all incorporated into the safe operating area curves. All applications should be checked against the curves to ensure high M.T.B.F. Governing Equation: TJ = PD x (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TC = Case Temperature TA = Ambient Temperature TS = Sink Temperature Example: (TO-8 PACKAGE) In our example the amplifier application requires the output to drive a 10 volt peak sine wave across a 100 ohm load for 0.1 amp of output current. For a worst case analysis we will treat the 0.1 amp peak output current as a D.C. output current. The power supplies are ±15 VDC. 1.) Find Power Dissipation PD=[(quiescent current) X (+VCC - (VCC))] + [(VS - VO) X IOUT] =(3.5 mA) X (30V) + (5V) X (0.1A) =0.1W + 0.5W =0.6W 2.) For conservative design, set TJ = +150°C. 3.) For this example, worst case TA = +25°C. 4.) RθJC = 85°C/W 5.) Rearrange governing equation to solve for RθSA: RθSA =(TJ - TA) / PD - (RθJC) - (RθCS) = (150°C - 25°C) / 0.6W - (85°C/W) - (0.15°C/W) = 123°C/W The heat sink in this example must have a thermal resistance of no more than 123°C/W to maintain a junction temperature of less than +150°C. This calculation assumes a case to sink thermal resistance of 0.15°C/W. |
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