BAS40-06 datasheet(2/4 Pages) VISHAY

2 / 4 page

BAS40-00 to BAS40-06

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Vishay Semiconductors

Rev. 2.2, 13-Feb-18

Document Number: 85701

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Note

(1) Device on fiberglass substrate, see layout on next page

Note

(1) Pulse test tp < 300 μs

LAYOUT FOR RthJA TEST

Thickness:



Fiberglass 1.5 mm (0.059 inches)



Copper leads 0.3 mm (0.012 inches)

THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

Thermal resistance junction to ambient air (1)

RthJA

500

K/W

Junction temperature

125

°C

Storage temperature range

Tstg

-65 to +150

°C

Operating temperature range

Top

-55 to +125

°C

ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

MIN.

TYP.

MAX.

UNIT

Reverse breakdown voltage

IR = 10 μA (pulsed)

V(BR)

Leakage current

VR = 30 V

100

Forward voltage

IF = 1 mA

380

Forward voltage (1)

IF = 40 mA

1000

Diode capacitance

VR = 0 V, f = 1 MHz

Reverse recovery time

IF = IR = 10 mA, iR = 1 mA, RL = 100 

trr

5ns

17451

15 (0.59)

12 (0.47)

0.8 (0.03)

5 (0.2)

7.5 (0.3)

3 (0.12)

1 (0.4)

2 (0.8)

1.5 (0.06)

5.1 (0.2)

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