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NVMFSC0D9N04C Datasheet(PDF) 2 Page - ON Semiconductor |
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NVMFSC0D9N04C Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 7 page ![]() NVMFSC0D9N04C www.onsemi.com 2 ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 40 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ ID = 250 mA, ref to 25°C 5 mV/°C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 40 V TJ = 25°C 10 mA TJ = 125°C 100 Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = +20 V 100 nA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250 mA 2.5 3.5 V Negative Threshold Temperature Coefficient VGS(TH)/TJ ID = 250 mA, ref to 25°C −8.6 mV/°C Drain−to−Source On Resistance RDS(on) VGS = 10 V ID = 50 A 0.69 0.87 mW CHARGES & CAPACITANCES Input Capacitance CISS VGS = 0 V, f = 1 MHz, VDS = 25 V 6100 pF Output Capacitance COSS 3400 Reverse Transfer Capacitance CRSS 70 Total Gate Charge QG(TOT) VGS = 10 V, VDS = 32 V; ID = 50 A 86 nC Gate−to−Source Charge QGS 28 Gate−to−Drain Charge QGD 14 Plateau Voltage VGP 4.9 V SWITCHING CHARACTERISTICS (Note 3) Turn−On Delay Time td(ON) VGS = 10 V, VDS = 32 V, ID = 50 A, RG = 2.5 W 54 ns Rise Time tr 160 Turn−Off Delay Time td(OFF) 220 Fall Time tf 170 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, IS = 50 A TJ = 25°C 0.8 1.2 V TJ = 125°C 0.65 Reverse Recovery Time tRR VGS = 0 V, dIS/dt = 100 A/ms, IS = 50 A 91 ns Charge Time ta 42 Discharge Time tb 49 Reverse Recovery Charge QRR 159 nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Switching characteristics are independent of operating junction temperatures. |
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