BYV26DGP datasheet(2/5 Pages) VISHAY

2 / 5 page

BYV26DGP, BYV26EGP

www.vishay.com

Vishay General Semiconductor

Not for New Designs

Revision: 06-Oct-2021

Document Number: 88554

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Notes

(1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on PCB with 0.5" x 0.5" (12 mm x 12 mm) copper pads

(2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink

ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

TEST CONDITIONS

SYMBOL

BYV26DGP

BYV26EGP

UNIT

Minimum avalanche breakdown voltage

100 μA

VBR

900

1100

Maximum instantaneous forward voltage

1.0 A

TJ = 25 °C

2.5

TJ = 175 °C

1.3

Maximum DC reverse current at rated DC

blocking voltage

TA = 25 °C

5.0

μA

TA = 165 °C

150

Max. reverse recovery time

IF = 0.5 A, IR = 1.0 A,

Irr = 0.25 A

trr

Typical junction capacitance

4.0 V, 1 MHz

THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

SYMBOL

BYV26DGP

BYV26EGP

UNIT

Typical thermal resistance

RθJA

(1)

°C/W

RθJL

(2)

ORDERING INFORMATION (Example)

PREFERRED P/N

UNIT WEIGHT (g)

PREFERRED PACKAGE CODE

BASE QUANTITY

DELIVERY MODE

BYV26EGP-E3/54

0.428

4000

13" diameter paper tape and reel

BYV26EGP-E3/73

0.428

2000

Ammo pack packaging

BYV26DGP Datasheet(PDF) 2 Page - Vishay Siliconix

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