MIC4425-YN datasheet(5/26 Pages) MICROCHIP

5 / 26 page



2022 Microchip Technology Inc. and its subsidiaries

DS20006638A-page 5

MIC4423/4/5

Test Circuit

FIGURE 1-1:

Inverting Driver Switching Time.

FIGURE 1-2:

Non-Inverting Driver Switching Time.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

+300

°C

—

Package Thermal Resistances

Thermal Resistance DIP

JA

—

130

—

°C/W

—

Thermal Resistance DIP

JC

—

Thermal Resistance Wide-SOIC

JA

—

120

—

Thermal Resistance Wide-SOIC

JC

—

Thermal Resistance SOIC

JA

—

120

—

Thermal Resistance SOIC

JC

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA).

tD1

90%

10%

tD2

OUTPUT

INPUT

90%

tPW 0.5μs

2.5V

tPW

INA

INB

MIC4423

OUTA

1800pF

VS = 18V

0.1μF

4.7μF

OUTB

1800pF

INA

INB

MIC4424

OUTA

1800pF

VS = 18V

0.1μF

4.7μF

OUTB

1800pF

90%

10%

V S

OUTPUT

INPUT

90%

tPW 0.5μs

tD1

tD2

tPW

2.5V

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