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ATLS500MA103 Datasheet(PDF) 9 Page - Analog Technologies, Inc. |
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ATLS500MA103 Datasheet(HTML) 9 Page - Analog Technologies, Inc. |
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9 / 11 page ![]() 1161 Ringwood Ct, #110, San Jose, CA 95131, U. S. A. Tel.: (408) 748-9100, Fax: (408) 770-9187 www.analogtechnologies.com Copyrights 2000-2022, Analog Technologies, Inc. All Rights Reserved. Updated on 1/18/2022 Email: staff@analogti.com/sales@analogti.com 9 Analog Technologies ATLS500MA106 Low Noise Constant Current Laser Controller MECHANICAL DIMENSIONS AND MOUNTING The ATLS500MA106 comes in 2 packages: through hole mount and surface mount. The former is often called DIP (Dual Inline package) or D (short for DIP) package and has a part number: ATLS500MA106 −D, and the latter is often called SMT (Surface Mount Technology) or SMD (Surface Mount Device) package and has a part number: ATLS500MA106 −S. See below Figure 13 and 14. Figure 13. Dimensions of the DIP Package Controller Figure 14. Dimensions of the SMT Package Controller “Tent” (i.e. cover the entire via by the solder mask layer) all the vias under the controller, otherwise, the vias can be shorted by the bottom plate of the controller which is internally connected the ground. Please notice that, in the recommended foot print for the DIP package, the holes for pin 2 to 6, and 8 to 12 have larger holes than needed for the pins. This arrangement will make it easier for removing the controller from the PCB, in case there is a rework needed. The two smaller holes, for pin 1 and 7, will hold the controller in the right position. It is also recommended to use large copper fills for VPS, PGND, and the LDC pins, and other pins if possible, to decrease the thermal resistance between the module and the supporting PCB, to lower the module temperature. Please be notice that the SMT version cannot be soldered by reflow oven. It must be soldered manually. 20 1.5 × 14 1.0 × 12 0.8 × 2 12 14.5 2 × 14 R1.0 × 4 PCB Copper without solder pad PCB Hole Orientation Mark Outline Figure 15. Top Side PCB Foot-print for the DIP Package Figure 15 shows the foot print which is seen from the top side of the PCB, therefore, it is a “see through” view. 3.0 × 14 1.5 × 14 PCB Copper with solder pad Figure 16. Top View of the Bottom Side PCB Foot-print Figure 16 shows the view of the bottom side PCB foot- print. Figure 17. Top View of the Bottom Side of Surface Mount PCB Foot-print Solder Pad Copper with Solder Mask |
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