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ATLS500MA103 Datasheet(PDF) 9 Page - Analog Technologies, Inc.

Part # ATLS500MA103
Description  Low Noise Constant Current Laser Controller
PDF  11 Pages
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Manufacturer  ANALOGTECHNOLOGIES [Analog Technologies, Inc.]
Direct Link  https://www.analogtechnologies.com/
Logo ANALOGTECHNOLOGIES - Analog Technologies, Inc.

ATLS500MA103 Datasheet(HTML) 9 Page - Analog Technologies, Inc.

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1161 Ringwood Ct, #110, San Jose, CA 95131, U. S. A. Tel.: (408) 748-9100, Fax: (408) 770-9187
www.analogtechnologies.com
Copyrights 2000-2022, Analog Technologies, Inc. All Rights Reserved. Updated on 1/18/2022
Email: staff@analogti.com/sales@analogti.com
9
Analog Technologies
ATLS500MA106
Low Noise Constant Current Laser Controller
MECHANICAL DIMENSIONS AND MOUNTING
The ATLS500MA106 comes in 2 packages: through hole
mount and surface mount. The former is often called DIP
(Dual Inline package) or D (short for DIP) package and has
a part number: ATLS500MA106
−D, and the latter is often
called SMT (Surface Mount Technology) or SMD (Surface
Mount Device) package and has a part number:
ATLS500MA106
−S. See below Figure 13 and 14.
Figure 13. Dimensions of the DIP Package Controller
Figure 14. Dimensions of the SMT Package Controller
“Tent” (i.e. cover the entire via by the solder mask layer)
all the vias under the controller, otherwise, the vias can be
shorted by the bottom plate of the controller which is
internally connected the ground.
Please notice that, in the recommended foot print for the
DIP package, the holes for pin 2 to 6, and 8 to 12 have
larger holes than needed for the pins. This arrangement
will make it easier for removing the controller from the
PCB, in case there is a rework needed. The two smaller
holes, for pin 1 and 7, will hold the controller in the right
position.
It is also recommended to use large copper fills for VPS,
PGND, and the LDC pins, and other pins if possible, to
decrease the thermal resistance between the module and
the supporting PCB, to lower the module temperature.
Please be notice that the SMT version cannot be soldered
by reflow oven. It must be soldered manually.
20
1.5
× 14
1.0
× 12
0.8
× 2
12
14.5
2
× 14
R1.0
× 4
PCB Copper
without solder pad
PCB Hole
Orientation Mark
Outline
Figure 15. Top Side PCB Foot-print for the DIP Package
Figure 15 shows the foot print which is seen from the top
side of the PCB, therefore, it is a “see through” view.
3.0
× 14
1.5
× 14
PCB Copper
with solder pad
Figure 16. Top View of the Bottom Side PCB Foot-print
Figure 16 shows the view of the bottom side PCB foot-
print.
Figure 17. Top View of the Bottom Side of Surface Mount
PCB Foot-print
Solder Pad
Copper with
Solder Mask



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