CC2652PSIP datasheet(58/72 Pages) TI

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11.6 Soldering and Reflow Condition

• Heating method: Conventional convection or IR convection

• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or

equivalent method

• Solder paste composition: SAC305

• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 11-1)

• Temperature profile: Reflow soldering will be done according to the temperature profile (see

Figure 11-1)

• Peak temperature: 260°C

Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder

Joint)

Table 11-1. Temperature Profile

Profile Elements

Convection or IR(1)

Peak temperature range

235 to 240°C typical (260°C maximum)

Pre-heat / soaking (150 to 200°C)

60 to 120 seconds

Time above melting point

60 to 90 seconds

Time with 5°C to peak

30 seconds maximum

Ramp up

< 3°C / second

Ramp down

< -6°C / second

(1)

For details, refer to the solder paste manufacturer's recommendation.

Note

TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module.

This coating can lead to localized stress on the solder connections inside the module and impact

the module reliability. Use caution during the module assembly process to the final PCB to avoid the

presence of foreign material inside the module.

CC2652PSIP

SWRS263A – FEBRUARY 2021 – REVISED JUNE 2022

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CC2652PSIP Datasheet(PDF) 58 Page - Texas Instruments