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DS20002100G-page 19

23A256/23K256

RECOMMENDED LAND PATTERN

Microchip Technology Drawing C04-2057-SN Rev H

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Dimension Limits

Units

C

Contact Pad Spacing

Contact Pitch

MILLIMETERS

1.27 BSC

MIN

E

MAX

5.40

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

1.55

0.60

NOM

E

X1

C

Y1

SILK SCREEN

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]