TLV704

SBVS148D – OCTOBER 2010 – REVISED JANUARY 2015

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Table of Contents

1

Features .................................................................. 1

8

Application and Implementation ........................ 12

8.1

Application Information............................................ 12

2

Applications ........................................................... 1

8.2

Typical Application .................................................. 12

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 13

4

Revision History..................................................... 2

10

Layout................................................................... 13

5

Pin Configuration and Functions ......................... 4

10.1

Layout Guidelines ................................................. 13

6

Specifications......................................................... 5

10.2

Layout Example .................................................... 13

6.1

Absolute Maximum Ratings ..................................... 5

10.3

Power Dissipation and Junction Temperature ...... 14

6.2

ESD Ratings ............................................................ 5

10.4

Estimating Junction Temperature ......................... 14

6.3

Recommended Operating Conditions ....................... 5

10.5

Package Mounting ................................................ 14

6.4

Thermal Information .................................................. 5

11

Device and Documentation Support ................. 15

6.5

Electrical Characteristics........................................... 6

11.1

Device Support .................................................... 15

6.6

Typical Characteristics .............................................. 7

11.2

Documentation Support ........................................ 15

7

Detailed Description ............................................ 10

11.3

Trademarks ........................................................... 15

7.1

Overview ................................................................. 10

11.4

Electrostatic Discharge Caution ............................ 15

7.2

Functional Block Diagram ....................................... 10

11.5

Glossary ................................................................ 15

7.3

Feature Description................................................. 10

12

Mechanical, Packaging, and Orderable

7.4

Device Functional Modes........................................ 11

Information ........................................................... 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (August, 2011) to Revision D

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

•

Changed fourth bullet in Features list .................................................................................................................................... 1

•

Changed Applications list ...................................................................................................................................................... 1

•

Changed front-page figure; removed pinout........................................................................................................................... 1

•

Changed Pin Configuration and Functions section; updated table format, renamed pin package to meet new

standards ............................................................................................................................................................................... 4

•

Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings .................................. 5

•

Changed "free-air" to "junction" temperature in condition statement for Recommended Operating Conditions ................... 5

•

Deleted Power Dissipation Rating table ................................................................................................................................. 5

•

•

Changed parametric symbol for line regulation ..................................................................................................................... 6

•

Changed parametric symbol for load regulation .................................................................................................................... 6

Changes from Revision B (November, 2010) to Revision C

Page

•

Revised document to reflect PK package option removal...................................................................................................... 1

•

Removed SOT89 (PK) package from front-page figure ......................................................................................................... 1

•

Deleted PK package information from Pin Functions table ................................................................................................... 4

•

Revised Thermal Information table and Power Dissipation Rating table .............................................................................. 5

•

•

Removed Figure 15 and Figure 16....................................................................................................................................... 14

2

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