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IRLR3110ZPBF Datasheet(PDF) 1 Page - International Rectifier |
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IRLR3110ZPBF Datasheet(HTML) 1 Page - International Rectifier |
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1 / 11 page  03/09/06 www.irf.com 1 HEXFET® is a registered trademark of International Rectifier. Description Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features com- bine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications. Features l Advanced Process Technology l Ultra Low On-Resistance l 175°C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET PD - 97175A IRLR3110ZPbF IRLU3110ZPbF HEXFET® Power MOSFET VDSS = 100V RDS(on) = 14mΩ S D G D-Pak IRLR3110ZPbF I-Pak IRLU3110ZPbF Absolute Maximum Ratings Parameter Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited) A ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) IDM Pulsed Drain Current PD @TC = 25°C Power Dissipation W Linear Derating Factor W/°C VGS Gate-to-Source Voltage V EAS (Thermally limited) Single Pulse Avalanche Energyd mJ EAS (Tested ) Single Pulse Avalanche Energy Tested Value h IAR Avalanche Current à A EAR Repetitive Avalanche Energy g mJ TJ Operating Junction and TSTG Storage Temperature Range °C Reflow Soldering Temperature, for 10 seconds Mounting Torque, 6-32 or M3 screw Thermal Resistance Parameter Typ. Max. Units RθJC Junction-to-Case j ––– 1.05 RθJA Junction-to-Ambient (PCB mount) ij ––– 40 °C/W RθJA Junction-to-Ambient j ––– 110 140 110 See Fig.12a, 12b, 15, 16 140 0.95 ±16 Max. 63 45 250 42 -55 to + 175 300 10 lbf yin (1.1Nym) |
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