Rev Date: 04/28/2020

13

www.seielect.com

This specification may be changed at any time without prior notice.

marketing@seielect.com

Please confirm technical specifications before you order and/or use.

FB Series

Multilayer Ferrite Chip Bead Inductor

Stackpole Electronics, Inc.

Resistive Product Solutions

Mechanical Performance Tests

Item

Specification

Test Condition / Test Method

Test device shall be soldered on the substrate

Substrate dimension: 100x40x1.6mm

Deflection: 2 mm

Keeping time: 30 seconds

For 0402, substrate dimension is 100x40x0.8mm

Test device shall be soldered on the substrate

Oscillation frequency: 10 to 55 to 10Hz for 1 minute

Amplitude: 1.5mm

Time: 2 hours for each axis (X,Y&Z). Total of 6 hours

Appearance: No damage

Pre-heating: 150°C, 1 minute

Solder temperature: 260±5°C

Immersion time: 10±1 seconds

Pre-heating: 150°C, 1 minute

Solder temperature: 245±5°C

Immersion time: 4±1 seconds

02 series: ≥0.2Kg

03 series: ≥0.5Kg

05 series: ≥1Kg

other series: ≥0.2Kg

One cycle:

Step 1: -55 ± 3°C for 30 minutes

Step 2: 25 ± 2°C for 3 minutes

Step 3: 125 ± 3°C for 30 minutes

Step 4: 25 ± 2°C for 3 minutes

Total: 100 cycles

Measured after exposure in the room condition for 24 hours

Temperature 40 ± 2°C

Appearance: No damage

Relative Humidity: 90~95% Time: 1000 hours

Impedance: within ±30% of initial value

Measured after exposure in the room condition for 24 hours

Temperature 125 ± 3°C

Relative Humidity: 0%

Applied Current: Rated Current Time 1000 hours

Measured after exposure in the room condition for 24 hours

Temperature: -55 ± 3°C

Relative Humidity: 0 Time: 1000 hours

Measured after exposure in the room condition for 24 hours

Test device shall be soldered on the substrate

Operating temperature: -55°C ~ 125°C

Storage temperature: 25 ± 3°C . Humidity < 80% RH

High Temperature Resistance

Low Temperature Resistance

Solderability

The electrodes shall be at least 90%

covered with new solder coating

Temperature Cycle

Humidity Resistance

Terminal Strength Test

The forces applied on the right conditions

must not damage the terminal electrode and

the ferrite

Vibration

Flexure Strength

More than 75% of the terminal electrode

should be covered with solder. Impedance:

within ± 30% of initial value

Resistance to Soldering Heat