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STD12N60DM2AG Datasheet(PDF) 2 Page - STMicroelectronics |
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STD12N60DM2AG Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 15 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID Drain current (continuous) at Tcase = 25 °C 10 A Drain current (continuous) at Tcase = 100 °C 6.3 IDM (1) Drain current (pulsed) 25 A PTOT Total power dissipation at Tcase = 25 °C 110 W dv/dt(2) Peak diode recovery voltage slope 50 V/ns dv/dt(3) MOSFET dv/dt ruggedness 50 Tstg Storage temperature range -55 to 150 °C Tj Operating junction temperature range 1. Pulse width is limited by safe operating area. 2. ISD ≤ 10 A, di/dt= 800 A/μs; VDS peak < V(BR)DSS,VDD = 400 V 3. VDS ≤ 480 V. Table 2. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 1.14 °C/W Rthj-pcb (1) Thermal resistance junction-pcb 50 1. When mounted on 1 inch² FR-4 board, 2oz Cu. Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR (1) Avalanche current, repetitive or not repetitive 2 A EAS (2) Single pulse avalanche energy 250 mJ 1. pulse width limited by Tjmax 2. starting Tj = 25 °C, ID = IAR, VDD = 50 V. STD12N60DM2AG Electrical ratings DS12209 - Rev 4 page 2/15 |
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