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SFH4650 Datasheet(PDF) 7 Page - OSRAM GmbH |
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SFH4650 Datasheet(HTML) 7 Page - OSRAM GmbH |
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7 / 8 page ![]() Vorl äufige Daten / Preliminary Data SFH 4650, SFH 4655 2005-03-087 Empfohlenes L ötpaddesign Recommended Solderpad Design Bauteil positioniert Component location on pad 1.7 OHF02421 Solder resist Paddesign for improved heat dissipation Cu-area 2 OHF02422 2.4 heat dissipation Solder resist Paddesign for improved Cu-area 2 Component location on pad Bauteil positioniert |
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