US2A THRU US2M

Features

· Low profile package

· Ideal for automated placement

· Glass passivated chip junctions

· Ultrafast reverse recovery time

· Low switching losses, high efficiency

· High forward surge capability

· High temperature soldering：

260℃/10 seconds at terminals

Maximum Ratings And Electrical characteristics

(

unless otherwise noted)

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum average forward rectified current

V

Symbols

Units

℃

A

Items

Mechanical Data

· Case : DO-214AC(SMA) molded plastic body

over glass passivated chip

· Polarity : Laser band denotes cathode end

· Terminals : Solder plated, solderable per

JESD22-B102D

VRRM

μA

Dimensions in inches and (millimeters)

ULTRAFAST RECOVERY RECTIFIER

CURRENT 2.0 A

VOLTAGE 50 to 1000 V

I(AV)

Operating junction and

storage temperature range

Maximum DC blocking voltage

US2A

V

A

pF

Thermal resistance from junction to lead

VF

IR

TRR

VRMS

ns

NOTE :

(1) Reverse recovery test conditions : IF=0.5A, IR=1.0A, Irr=0.25A

(2) Measured at 1.0MHz and applied reverse voltage of 4.0 Volts.

(3) Mounted on P.C.B. with 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas.

50

35

50

US2B US2D US2G US2J US2K US2M

100

70

100

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

1000

V

Peak forward surge current 8.3ms single

half sine-wave superimposed on rated load

(JEDEC method)

TJ, TSTG

50

℃/W

VDC

IFSM

TA=25℃

TA=125℃

-55 to + 150

RθJL

2.0

1.3

1.0

1.7

V

5.0

50

50

75

15

35

CJ

Typical junction capacitance

Maximum reverse recovery time(1)

(2)

(3)

Maximum instantaneous forward voltage

at 2.0A

Reverse currnet VR=VDC

TA=25℃

DO-214AC (SMA)

0.006(0.152)

0.012(0.305)

0.194(4.93)

0.222(5.65)

0.078(1.98)

0.960(2.42)

0.157(3.99)

0.177(4.50)

0.100(2.54)

0.110(2.80)

0.008(0.203)

MAX.

0.049(1.25)

0.067(1.70)

0.030(0.76)

0.060(1.52)

https://dec.co.kr

DAESAN ELECTRONIC CORP.