DS31224 Rev. 4 - 2

1 of 4

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DEMD48

© Diodes Incorporated

DEMD48

DUAL NPN/PNP PRE-BIASED TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Surface Mount Package Suited for Automated Assembly

•

Simplifies Circuit Design and Reduces Board Space

•

Lead Free/RoHS Compliant (Note 1)

•

"Green" Device (Note 2)

Mechanical Data

•

Case: SOT-563

•

Case Material: Molded Plastic, “Green” Molding Compound. UL

Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish

⎯ Matte Tin Finish annealed over Copper

leadframe. Solderable per MIL-STD-202, Method 208

•

Marking Information: See Page 4

•

Ordering Information: See Page 4

•

Weight: 0.005 grams (approximate)

Reference

Device Type

R1(Nom)

R2(Nom)

Q1

NPN

47k

Ω

47k

Ω

Q2

PNP

2.2 k

Ω

47k

Ω

SOT-563

6

Q

1

Q

2

54

3

12

R

1

R

2

R

1

R

2

47k

47k

2.2k

47k

Maximum Ratings, Total Device @TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 3)

PD

300

mW

Thermal Resistance, Junction to Ambient Air (Note 3)

RθJA

417

°C/W

Operating and Storage Temperature Range

Tj, TSTG

-55 to +150

°C

Maximum Ratings, Pre-Biased NPN Transistor, Q1 @TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

VCBO

50

V

Collector-Emitter Voltage

VCEO

50

V

Emitter-Base Voltage

VEBO

10

V

Input Voltage

VIN

-10 to +40

V

Output Current (DC)

IO

100

mA

Peak Collector Current

ICM

100

mA

Maximum Ratings, Pre-Biased PNP Transistor, Q2 @TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

VCBO

-50

V

Collector-Emitter Voltage

VCEO

-50

V

Emitter-Base Voltage

VEBO

-10

V

Input Voltage

VIN

-12 to +5

V

Output Current (DC)

IO

-100

mA

Peak Collector Current

ICM

-100

mA

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.