5

Technical Data ELX1147

Effective February 2022

2822HC

High current surface mount Brick fuse

www.eaton.com/electronics

Time

Tsmin

Tsmax

Tstyp

Tp

tp

First Wave

Second Wave

Preheat area

Cool down area

Reference

Profile feature

Standard SnPb solder

Lead (Pb) free solder

Preheat

• Temperature min. (Tsmin)

100 °C

100 °C

• Temperature typ. (Tstyp)

120 °C

120 °C

• Temperature max. (Tsmax)

130 °C

130 °C

• Time (Tsmin to Tsmax) (ts)

70 seconds

70 seconds

D preheat to max Temperature

150 °C max.

150 °C max.

Peak temperature (TP)*

235 °C – 260 °C

250 °C – 260 °C

Time at peak temperature (tp)

6 seconds max

3 seconds max each wave

6 seconds max

3 seconds max each wave

Ramp-down rate

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

Time 25 °C to 25 °C

4 minutes

4 minutes

Manual solder

+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended.

Wave solder profile