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TCR3DF12 Datasheet(PDF) 5 Page - Toshiba Semiconductor |
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TCR3DF12 Datasheet(HTML) 5 Page - Toshiba Semiconductor |
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5 / 14 page ![]() TCR3DF series 2013-11-15 5 Application Note 1. Recommended Application Circuit The figure above shows the recommended configuration for using a Low-Dropout regulator. Insert a capacitor at VOUT and VIN pins for stable input/output operation. (Ceramic capacitors can be used). 2. Power Dissipation Both unit and board-mounted power dissipation ratings for TCR3DF series are available in the Absolute Maximum Ratings table. Power dissipation is measured on the board shown below. Testing Board of Thermal Resistance CONTROL voltage Output voltage HIGH ON LOW OFF OPEN OFF VOUT GND VIN CONTROL NC ● SMV *Board material: FR4 board Board dimension: 25.4 mm × 25.4 mm × 1.6 mm Copper area: 645 mm2 Ambient temperature Ta (°C) PD – Ta (SMV) − 40 0 0 40 120 80 200 400 600 800 ① Board dimension 25.4 mm x 25.4 mm, x 1.6 mm Copper area 645 mm2, mounted on FR4 Board ② Unit Rating ② ① |
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