CPD65 datasheet(1/2 Pages) CENTRAL

Part #	CPD65

Description	Low Leakage Diode Picoampere Diode Chip

PDF	2 Pages

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Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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1 / 2 page

Central

Semiconductor Corp.

TM

PROCESS

CPD65

Low Leakage Diode

Picoampere Diode Chip

PRINCIPAL DEVICE TYPES

BAV45

Process

EPITAXIAL PLANAR

Die Size

9.5 X 9.5 MILS

Die Thickness

7.5 MILS

Anode Bonding Pad Area

2.5 MILS DIAMETER

Top Side Metalization

Al - 30,000Å

Back Side Metalization

Au - 13,000Å

GEOMETRY

PROCESS DETAILS

BACKSIDE CATHODE

R1 (1-August 2002)

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

GROSS DIE PER 4 INCH WAFER

125,200

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