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CPD77 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CPD77 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
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1 / 1 page ![]() PROCESS CPD77 Schottky Rectifier 3.0A Schottky Barrier Rectifier Chip PRINCIPAL DEVICE TYPES CTLSH3-30M833 GEOMETRY PROCESS DETAILS R0 (02 -March 2006) Process EPITAXIAL PLANAR Die Size 61 x 61 MILS Die Thickness 9.8 MILS Anode Bonding Pad Area 55 x 55 MILS Top Side Metalization Ti/Ag - (2,500Å/30,000Å) Back Side Metalization Ti/Ni/Au - (1,600Å/5,550Å/1,500Å) 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com GROSS DIE PER 4 INCH WAFER 3,118 |
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